"We will reduce wafer starts at Dresden in order to reduce costs and safeguard liquidity. With this liquidity, we intend to expedite the development of our 46-nm buried wordline technology, with which we can achieve market leading productivity and efficiency. The preliminary insolvency administrator and the creditors' committee have agreed to this approach," said Frank Prein, general manager of Qimonda Dresden GmbH & Co. OHG, in a statement.
The reduction of wafer starts will have no immediate effect on deliveries to customers. Unused equipment will be placed in a standby mode and can be ramped-up again at short notice, Qimonda said.
Qimonda cuts Dresden production to 25 percent
Posted on Tuesday, February 10 2009 @ 20:58 CET by Thomas De Maesschalck